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The EFD20 PoE++ Transformer is developed for next-generation Ethernet power systems requiring higher power transmission capability, stable signal integrity, and reliable isolation protection. Designed with an EFD20 ferrite core structure, it supports efficient magnetic coupling and compact integration for modern PoE networking equipment.
Optimized for IEEE 802.3bt PoE++ standards, the transformer enables simultaneous data communication and power delivery over Ethernet cabling, making it suitable for high-power intelligent network devices.
Its compact low-profile structure helps improve PCB space utilization while maintaining strong thermal stability under continuous network operation.
Customized electrical parameters, winding arrangements, insulation designs, and mounting structures are available for different Ethernet power architectures.
Designed for IEEE 802.3bt PoE++ systems
EFD20 compact ferrite core structure
High-efficiency power and signal transmission
Reliable isolation protection performance
Optimized for high-power Ethernet devices
Low-profile PCB integration capability
Stable thermal operating characteristics
Custom design support available
PoE++ Ethernet Switches
Smart IP Surveillance Cameras
Wireless Networking Equipment
Industrial Ethernet Controllers
Smart Building Infrastructure
Edge Computing Devices
Intelligent IoT Gateways
Physical Propertie
| Order Code | VIN | Vout1 (V) | lout1 (A) | Vout2 (V) | lout2 (A) | Vaux (V) | L (μH) | n | lSAT ( A) | VT (V(AC)) |
| INF-EFD20-66μH | 33-57V(DC) | 5 | 19 | - | - | 12 | 66 | 4:1:2.5 | - | 1500 |
| INF-EFD20-66μH | 33-57V(DC) | 12 | 8 | - | - | 12 | 66 | 1.6:1:1:1 | - | 1500 |
| INF-EFD20-66μH | 33-57V(DC) | 5 | 14.6 | - | - | 12 | 66 | 4:1:2.5 | - | 1500 |
| INF-EFD20-66μH | 33-57V(DC) | 12 | 6 | - | - | 12 | 66 | 1.6:1:1:1 | - | 1500 |
| INF-EFD20-16μH | 33-57V(DC) | 12 | 6 | - | - | 12 | 16 | 2.33:1:1 | 10.4 | 1500 |
| INF-EFD20-16μH | 33-57V(DC) | 24 | 3 | - | - | 12 | 16 | 2:1.86:1 | 10.4 | 1500 |
| INF-EFD20-16μH | 33-57V(DC) | 5 | 14.6 | - | - | 12 | 16 | 4.67:1:2.33 | 10.4 | 1500 |
| INF-EFD20-154μH | 30-57V(DC) | 12 | 5 | -12 | 1.6 | 12 | 154 | 2:1:1:1 | - | 1500 |
| INF-EFD20-100μH | 36-72V(DC) | 12 | 5 | - | - | 12 | 100 | 2:1:1 | - | 1500 |
| INF-EFD20-175μH | 40-57V(DC) | 5 | 17 | - | - | 10.75 | 175 | 3.5:1:2.25 | - | 2400 |
| INF-EFD20-150μH | 36-72V(DC) | 5 | 12 | - | - | 13 | 150 | 4:1:2.6 | - | 1500 |
| INF-EFD20-100μH | 36-57V(DC) | 24 | 2.5 | - | - | 12 | 100 | 2:2:1 | 1.8 | 1500 |
Technical Specifications
| Main Category | Subcategory | Details |
| MOQ | Prototyping & Small-batch | 10 piece minimum order |
| Sample Service | Free proofing & custom service, 5 free samples (shipping at buyer’s cost) | |
| Bulk Order | 5,000 pieces and above with bulk pricing | |
| Lead Time | All Standard Components | Shipped within 5–7 working days |
| Custom Inductance / Pin Design (Sample) | Sample order confirmed within 5–7 working days | |
| Custom Inductance / Pin Design (Mass Order) | Shipped within 15–30 working days | |
| Payment Terms | Main Payment Term | T/T in advance, L/C at sight |
| Procurement Standard | Complies with global enterprise procurement standard for passive components | |
| Quality Deposit | No quality security deposit required | |
| Accepted Terms | FOB Shanghai / Nanjing / Hong Kong, T/T Advance | |
| Quality Assurance | Manufacturing Defects | Free replacement for issues caused by manufacturing defects |
| Inspection Report | Batch inspection reports available as certification upon customer request | |
| Packaging Specifications | Updated Packaging (2026) | Blister tray packaging; Sealed Tape & Reel for SMD products |
| Optional Packaging | Vacuum sealed packaging for customers with strict moisture-proof requirements |