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1. Compact EFD25 Core Structure
The EFD25 core features an optimized footprint that balances power density and board space, ideal for medium‑power applications requiring compact design and efficient layout.
2. High Insulation & Safety Performance
Designed with reinforced insulation and creepage/clearance distances that meet international safety standards, providing reliable primary–secondary isolation.
3. Excellent Voltage Regulation
Precisely engineered winding design delivers stable output voltage with minimal fluctuation under varying load conditions, improving end‑product reliability.
4. High Efficiency with Low Heat Generation
Optimized core and winding materials reduce core and copper loss, enhancing efficiency and reducing system thermal stress.
5. Wide Operating Temperature Range
Reliable performance across a broad temperature range, making it suitable for both industrial and consumer environments.
6. Low Noise Operation & Vibration Resistance
Optimized magnetic design contributes to reduced audible noise and enhanced reliability in sensitive electronics.
· Texas Instruments ICs
Physical Properties
| Order Code | VIN | Vout1 (V) | lout1 (mA) | Vout2 (V) | lout2 (mA) | Vout3 (V) | lout3 (mA) | Vaux (V) | Vaux2 (V) | L (μH) | fswich (kHz) | NPRI:NSEC:NAUX | lSAT (A) | VT (V(AC)) |
| INF-EFD25-380μH | 85-265V(AC) | 12 | 3000 | - | - | - | - | 12 | - | 380 | 60-120 | 7:1:1 | 3.3 | 4500 |
Technical Specifications

| Main Category | Subcategory | Details |
| MOQ | Prototyping & Small-batch | 10 piece minimum order |
| Sample Service | Free proofing & custom service, 5 free samples (shipping at buyer’s cost) | |
| Bulk Order | 5,000 pieces and above with bulk pricing | |
| Lead Time | All Standard Components | Shipped within 5–7 working days |
| Custom Inductance / Pin Design (Sample) | Sample order confirmed within 5–7 working days | |
| Custom Inductance / Pin Design (Mass Order) | Shipped within 15–30 working days | |
| Payment Terms | Main Payment Term | T/T in advance, L/C at sight |
| Procurement Standard | Complies with global enterprise procurement standard for passive components | |
| Quality Deposit | No quality security deposit required | |
| Accepted Terms | FOB Shanghai / Nanjing / Hong Kong, T/T Advance | |
| Quality Assurance | Manufacturing Defects | Free replacement for issues caused by manufacturing defects |
| Inspection Report | Batch inspection reports available as certification upon customer request | |
| Packaging Specifications | Updated Packaging (2026) | Blister tray packaging; Sealed Tape & Reel for SMD products |
| Optional Packaging | Vacuum sealed packaging for customers with strict moisture-proof requirements |