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Add : Room 701, Building A1, No. 55 Runfa Road, Jiangning District, Nanjing, China
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The 2013 SMT High Current Inductor is designed for compact electronic systems requiring efficient energy storage, stable inductance characteristics, and reliable high-current operation. Its miniature surface-mount structure supports high-density PCB layouts and automated assembly processes for modern power management applications.
Optimized for high-frequency switching circuits, the inductor provides effective ripple current suppression and stable electrical performance in compact DC-DC converter environments.
The 2013 series is especially suitable for space-constrained electronic products where compact size, thermal stability, and efficient current handling capability are critical.
Customized inductance values, current specifications, package dimensions, and winding configurations are available according to customer application requirements.
Compact SMT surface-mount structure
High current handling capability
Stable inductance performance
Efficient energy storage characteristics
Reliable ripple current suppression
Suitable for high-density PCB layouts
Optimized for switching power systems
Flexible customization support
DC-DC Converter Modules
Voltage Regulator Circuits
Portable Electronic Devices
Embedded Power Systems
Communication Electronics
Consumer Electronic Products
Compact Switching Power Supplies
Physical Properties
Order Code | L(μH) | lRP,40K(A) | lSAT,10%(A) | lSAT,30%(A) | RDC max.(mΩ) | fres(MHz) |
| INF-2013-0.7μH | 0.7 | 54.7 | 63 | 75 | 0.91 | 65 |
| INF-2013-1.4μH | 1.4 | 47.1 | 55 | 60 | 1.19 | 52 |
| INF-2013-2.2μH | 2.2 | 39.5 | 47 | 52 | 1.65 | 32 |
| INF-2013-3.1μH | 3.1 | 33.15 | 41 | 45 | 2.3 | 29 |
| INF-2013-4.2μH | 4.2 | 27 | 34 | 38 | 3.34 | 24 |
| INF-2013-5.5μH | 5.5 | 23.35 | 30 | 33 | 4.4 | 21 |
| INF-2013-7μH | 7 | 19.5 | 27 | 30 | 6.17 | 18 |
| INF-2013-8.6μH | 8.6 | 17.1 | 23.5 | 25 | 7.91 | 14 |
| INF-2013-10μH | 10 | 16.15 | 22 | 23 | 8.76 | 13 |
| INF-2013-15μH | 15 | 15.4 | 19 | 21 | 9.57 | 12.8 |
| INF-2013-22μH | 22 | 13.8 | 13 | 15 | 11.72 | 12.5 |
| INF-2013-33μH | 33 | 13.3 | 9.5 | 11 | 12.54 | 12 |
| INF-2013-47μH | 47 | 12.8 | 7.5 | 8.5 | 13.42 | 10 |
Technical Specifications
| Main Category | Subcategory | Details |
| MOQ | Prototyping & Small-batch | 10 piece minimum order |
| Sample Service | Free proofing & custom service, 5 free samples (shipping at buyer’s cost) | |
| Bulk Order | 5,000 pieces and above with bulk pricing | |
| Lead Time | All Standard Components | Shipped within 5–7 working days |
| Custom Inductance / Pin Design (Sample) | Sample order confirmed within 5–7 working days | |
| Custom Inductance / Pin Design (Mass Order) | Shipped within 15–30 working days | |
| Payment Terms | Main Payment Term | T/T in advance, L/C at sight |
| Procurement Standard | Complies with global enterprise procurement standard for passive components | |
| Quality Deposit | No quality security deposit required | |
| Accepted Terms | FOB Shanghai / Nanjing / Hong Kong, T/T Advance | |
| Quality Assurance | Manufacturing Defects | Free replacement for issues caused by manufacturing defects |
| Inspection Report | Batch inspection reports available as certification upon customer request | |
| Packaging Specifications | Updated Packaging (2026) | Blister tray packaging; Sealed Tape & Reel for SMD products |
| Optional Packaging | Vacuum sealed packaging for customers with strict moisture-proof requirements |
