English 
Add : Room 701, Building A1, No. 55 Runfa Road, Jiangning District, Nanjing, China
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High inductance stability with low core loss
Optimized for PFC circuits, improving power factor efficiency
High current capability with low temperature rise
Compact PQ38/11 structure for space-saving designs
Excellent EMI suppression performance
·Active power factor correction
·Lighting applications
·SMPS for 75 W - 250 W
·Modes of operation: DCM
Physical Propertie
| Order Code | VIN (V) | L (μH) | n | lR (A) | ISAT (A) | RDC1 max (mΩ) | RDC2 max (mΩ) | VT (V(AC)) |
| INF-PQ38/11-300μH | 85-265V(AC) | 300 | 8:75:1 | 3 | 5.1 | 197.3 | 310 | 1500 |
Technical Specifications
| Main Category | Subcategory | Details |
| MOQ | Prototyping & Small-batch | 10 piece minimum order |
| Sample Service | Free proofing & custom service, 5 free samples (shipping at buyer’s cost) | |
| Bulk Order | 5,000 pieces and above with bulk pricing | |
| Lead Time | All Standard Components | Shipped within 5–7 working days |
| Custom Inductance / Pin Design (Sample) | Sample order confirmed within 5–7 working days | |
| Custom Inductance / Pin Design (Mass Order) | Shipped within 15–30 working days | |
| Payment Terms | Main Payment Term | T/T in advance, L/C at sight |
| Procurement Standard | Complies with global enterprise procurement standard for passive components | |
| Quality Deposit | No quality security deposit required | |
| Accepted Terms | FOB Shanghai / Nanjing / Hong Kong, T/T Advance | |
| Quality Assurance | Manufacturing Defects | Free replacement for issues caused by manufacturing defects |
| Inspection Report | Batch inspection reports available as certification upon customer request | |
| Packaging Specifications | Updated Packaging (2026) | Blister tray packaging; Sealed Tape & Reel for SMD products |
| Optional Packaging | Vacuum sealed packaging for customers with strict moisture-proof requirements |
